SDG Electronics

Thermal path and heatsink

Steady series thermal path, measured-package PsiJT estimate, or user-supplied transient thermal impedance.

Development preview. Check the assumptions below before relying on a result. Calculations run in your browser.

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How it calculates

Assumptions

  • ThetaJA depends on board, airflow and mounting; the datasheet reference-board value is not a universal property.
  • PsiJT is a characterization parameter used with measured package-top temperature, not a series thermal resistance and not a heatsink design parameter.
  • Pulse mode uses absolute single-pulse Zth (K/W), logarithmic interpolation and an initially uniform junction temperature. Repetitive pulse superposition is not included.

Worked example

These are the calculator's default inputs. Change any input above to recalculate.

Inputs

Thermal model
heatsink
Device power / pulse power
5 W
Ambient / initial junction temperature
25 °C
Maximum junction temperature
125 °C
Junction-case resistance
2 K/W
Case-sink resistance
0.5 K/W
Sink-ambient resistance
10 K/W
Assembly thetaJA
40 K/W
Measured package-top temperature
65 °C
PsiJT characterization parameter
1 K/W
Pulse duration
0.01 s
Zth time coordinates
0.001, 0.01, 0.1, 1, 10 s
Absolute transient Zth coordinates
0.1, 0.5, 2, 10, 20 K/W

Results

Estimated junction temperature
87.5 °C
Maximum permissible sink resistance
17.5 K/W
Thermal coefficient used
12.5 K/W
Power at junction limit
8 W

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